S Korea-chip industry Industry ministry signs MOU with Samsung, SK hynix on semiconductor packaging SEOUL, Aug. 29 (Yonhap) -- The industry ministry said Tuesday it signed a memorandum of understanding (MOU) with Samsung Electronics Co., SK hynix Inc. and other chip firms to cooperate on technology development for advanced semiconductor packaging. Under the MOU, the government and chipmakers agreed to work together to secure leading technologies in advanced semiconductor packaging and to nurture companies in the final steps of semiconductor manufacturing, according to the Ministry of Trade, Industry and Energy.

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