PITTSBURGH, Aug. 17, 2022 (GLOBE NEWSWIRE) — II‐VI Incorporated (Nasdaq: IIVI), a leader in wide-bandgap compound semiconductors, today announced that it closed an over $100 million contract to supply Dongguan Tianyu Semiconductor Technology Co., Ltd., with 150 mm silicon carbide substrates to be delivered beginning this quarter and through the end of calendar year 2023. The electrification of the transportation infrastructure and industrial equipment is accelerating a market transition to power electronics based on silicon carbide (SiC), a third-generation or wide-bandgap semiconductor.

http://www.padovanews.it/2022/08/18/ii-vi-incorporated-closes-100-million-contract-to-supply-tianyu-with-silicon-carbide-substrates-for-power-electronics/

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