AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

2026-04-08 12:15

AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

https://www.cnbc.com/2026/04/08/tsmc-nvidia-advanced-packaging-intel.html

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